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Wafer Cutting machine
220000 INR/Unit
Product Details:
- Product Type Food Processing
- Power Source Electricity
- Operating Type Automatic
- Warranty 1 Year
- Usage/Applications Industrial
- Supply Ability : 5000 Unit Per Month
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Price And Quantity
- 220000 INR/Unit
- 1 Unit
Product Specifications
- 1 Year
- Food Processing
- Electricity
- Industrial
- Automatic
Trade Information
- 5000 Unit Per Month
- 10 Days
- All India
Product Description
To extract individual chips (or dies) from a larger semiconductor wafer, a wafer cutting machine also referred to as a dicing saw or wafer saw is a piece of machinery used in the semiconductor manufacturing industry. Various electrical devices, such as integrated circuits (ICs), utilise these chips after then.
There are multiple steps in the wafer cutting process:
- Alignment: Using alignment markers, the wafer's position on a stage is properly aligned. This guarantees precise cutting and guards against chip damage.
- Wafer mounting: To keep the wafer in position during the cutting process, it is firmly attached on a vacuum chuck or sticky tape.
- Cutting: The wafer is cut along predetermined lines using a high-speed spinning blade or laser. In order to avoid contamination, the cutting procedure is normally carried out in a controlled setting, such as a cleanroom.
- Cleaning: Following the cutting operation, the separated chips are cleaned to get rid of any debris or particles that were produced.
- Inspection: To ensure they meet the necessary requirements for quality control, the separated chips are examined.
Wafer cutting machines' parameters, such as their cutting speed, accuracy, and kind of cutting technique (laser or blade), can vary. The kind of wafer being processed and the unique specifications of the semiconductor producer determine the machine to be used.
It is important to keep in mind that the semiconductor business is constantly changing, and new technologies and techniques for cutting wafers may be developed after the knowledge cutoff date of September 2021.
FAQ
1. What does a wafer-chopping device do?
Ans - A specialised machine called a wafer cutting machine is used to slice wafers into bars or portions. Typically, it is used to make baked goods like cookies, chocolates, and other baked goods.
2. How does a wafer-cutter operate?
Ans- A sheet of uncut wafer is sandwiched between two cutting blades to operate a wafer cutting machine. The wafer is divided into sections or bars by the opposing motion of the blades.
3. Who employs a wafer-cutter?
Ans - Commercial bakers, chocolatiers, and food makers who need accurate wafer cuts for production employ wafer cutting equipment.
4. What varieties of wafers can a wafer cutting machine cut?
Ans - Chocolate, almond, and graham wafers are just a few of the many wafer varieties that may be sliced with wafer cutting machines.
5. Are wafer cutters safe to use?
Ans - When used appropriately, wafer cutting machines are safe to use. To reduce the chance of injury, they are built with safety features such guards.
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